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    Полное описание

    The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects : сборник / edited by Günter Grossmann, Christian Zardini. - London : Springer, 2011. - on-line. - URL: http://dx.doi.org/10.1007/978-0-85729-236-0. - Загл. с экрана. - ISBN 978-0-85729-236-0. - Текст : электронный.
    Содержание:
    1. Deformation and Fatigue of Solders -- 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints -- 3. Thermal Fatigue Analysis -- 4. Electrochemical Behavior of Solder Alloys -- 5. Void Formation by Kirkendall Effect in Solder Joints -- 6. Tin Whiskers -- 7. Electromigration in Solder Interconnects -- 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold -- 9. Reliability of Electronic Assemblies under Mechanical Shock Loading -- 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration -- 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates -- 12. PCB Delamination -- 13. Excessive Warpage of Large Packages during Reflow Soldering -- 14. Popcorn Cracking -- 15. Thermal Capability of Components.

    ГРНТИ УДК
    81.35.31621.791.3

    Рубрики:
    engineering
    quality control
    reliability
    industrial safety
    electronics
    microelectronics
    optical materials
    electronic materials
    materials science
    engineering
    electronics and Microelectronics, Instrumentation
    optical and Electronic Materials
    quality Control, Reliability, Safety and Risk
    characterization and Evaluation of Materials

    Аннотация: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
    Доп. точки доступа:
    Grossmann, G.\editor.\
    Zardini, C.\editor.\

    http://dx.doi.org/10.1007/978-0-85729-236-0


    Держатели документа:
    Государственная публичная научно-техническая библиотека России : 123298, г. Москва, ул. 3-я Хорошевская, д. 17 (Шифр в БД-источнике (KATBW): -511327632)

    Шифр в сводном ЭК: a2cd6332aeff8e17f9c9781000ff3154



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