Полное описание

Perkins, A. E. Solder joint reliability prediction for multiple environments / A. E. Perkins, S. K. Sitaraman. - Electronic text data. - Boston, Ma : Springer Science+Business Media LLC, 2009. - URL: http://dx.doi.org/10.1007/978-0-387-79394-8. - ISBN 978-0-387-79394-8.
Рубрики:
Engineering
System safety
Electronics
Optical materials
Materials
Engineering
Electronics and microelectronics, instrumentation
Metallic materials
Optical and electronic materials
Quality control, reliability, safety and risk

Доп. точки доступа:
Sitaraman, S.K.
SpringerLink (Online service)

http://dx.doi.org/10.1007/978-0-387-79394-8

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